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OEM Summit Takeaways

IPC hosted its first OEM Summit at APEX EXPO last week. Panelists included Martin Rausch, GM, System Manufacturing, Intel; Kitty Pearsall, Ph.D., DE, ISC Procurement Engineering, IBM; and Michael...

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IPC-2581 Consortium Opens its Doors to New Members

Getting OEMs, design tool providers, EMS providers and others to agree on a standard for transferring data files has proven a difficult challenge. The IPC-2581 Consortium, formed to help industry...

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3D IC Integration and 3D IC Packaging

3D IC integration is taking the semiconductor industry by storm. It has been: (a) impacting chip suppliers, fab-less design houses, foundries, integrated device manufacturers, outsourced semiconductor...

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Fail to Prepare, Prepare to Fail

By Jennifer Read, Consultant That’s a quote from Ben Franklin cited by IPC CEO John Mitchell in a video blog about the recently published IPC Study of the North American Labor Pool for Electronics...

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